Japanese semiconductor manufacturer Rohm has unveiled a new compact HSDIP20 package using 4th generation SiC MOSFETs. The SiC modules were specifically developed for automotive applications. The innovation promises enhanced performance, reliability, and easier system integration.
Rohm has announced the introduction of a new HSDIP20 for PFC and LLC converters in onboard chargers for electric vehicles. The HSDIP20 is a 4- in-1 or 6-in-1 module and measures just 38 x 31.3x 3.5 mm. It is said to offer industry-leading current density that enables fast charging, and is supposed to meet the growing demands for more compact, efficient, and high-performance power electronics in electric and hybrid vehicles.
The line-up includes modules incorporating six Sic MOSFETs for the PFC circuit and four for the isolated DC/DC circuit in onboard chargers with power ratings from 7 to 22 kW.
“All basic circuits required for power conversion in various high-power applications are integrated into a compact module package, reducing the design workload for manufacturers and enabling the miniaturization of power conversion circuits in OBCs and other applications,” the company states.
As the new HSDIP20 includes the above-mentioned number of models, it is much smaller than if these had to be installed individually. Rohm specifies that the mounting area can be reduced by up to 52 per cent compared to top-side-cooling discrete components. Also, it reduces the number of components, enabling more compact and more powerful power circuits.
As electric vehicle technology matures, demand for longer ranges, improved charging speed, and higher battery voltages increases. That means that onboard chargers and DC-DC converters must become more powerful. At the same time, there is an increasing need for further miniaturisation and weight reduction for these applications.
Moreover, Rohm was able to enhance the package’s heat dissipation characteristics, which “could otherwise hinder progress.” When compared to an onboard charger with PFC (Power Factor Correction), the “HSDIP20 package was verified to be approx. 38°C cooler (at 25W operation).” Discrete products operating at high voltages need an insulation sheet between the heat dissipation surface and the heat sink. Rohm’s products use a high thermal conductivity ceramics filler. The insulation sheet is thus not necessary.
That means the latter supports higher currents despite its smaller size, Rohm emphasises, adding that the design helps achieve an “industry-leading power density more than three times higher than top-side cooled discretes and over 1.4 times that of similar DIP type modules. As a result, in the PFC circuit mentioned above, the HSDIP20 can reduce the mounting area by approximately 52% compared to top-side cooled discrete configurations, greatly contributing to the miniaturization of power conversion circuits in applications such as OBCs.”
rohm.com
